| 加工定制：是 | 品牌：美Mattson | 型号：Aspen? II |
| 用途：去胶 |
Aspen? II
First introduced in 1990, the Aspen II products provide proven process capability and cost of ownership benefits based on a highly reliable and productive product
design for chipmakers in high volume manufacturing. Mattson Technology
continues to innovate and support 200 mm strip and isotropic etch solutions for our customers.
Product Features:
·Aspen II inductively coupled plasma (ICP)
No device damage via soft plasma from proprietary Faraday shield ICP source
Process flexibility
·Fluorine / reducing chemistry
·Wide temperature range (100°C t300°C)
Dual wafer processing with individual head control provides excellent process uniformity
Vacuum loadlock isolates process chambers to minimize defects
High speed robot with simultaneous multi-wafer handling – high-throughput (> 130 wph)
Small footprint with highest throughput / square footprint in<200 mm strip products
Lower cost of consumables compared with microwave source strip products
Single or dual process chamber option
Wafer size: 100 mm, 150 mm, 200 mm
·Aspen II Silicon Soft Etch (SSE)
Isotropic etching for contact clean application
Highlights:
·Production Proven Low Cost of Ownership
Solution
More than 1,000 systems installed
across a wide range of device
manufacturers
·Continuous Improvement Program
Continuous commitment to develop
innovative CIPs to meet advanced
processing requirements and factory
automation requirements
·Customer Support
Continuous commitment to support
end-of-line / obsolescence
management
Cost effective refurbishment service
and re-manufacturing
Global customer support infrastructure
High fluorine (> 5%)
Applications:
·Memory
·Advanced Logic
·LED
·CMOS Sensor
·MEMS (Gyroscope, Microphone)
·Sensors
·Wafer Level Packaging
·Optoelectronics
·Analog / BCD / Mixed Signal
Process:
·Bulk PR Strip
·Implanted PR Removal
·Surface Treatment / Descum
·Residue Cleaning
STI Etch Residue Clean
Poly Gate Residue Clean
Contact / VIA Residue Clean
Metal Residue Clean
·Polyimide Rework / Treatment
·Photo-lithography ReworkPassivation
·Passivation
