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Helios XP 快速热处理设备

Helios XP 快速热处理设备

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  • 发货地:广东 深圳
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加工定制:是品牌:Helios型号:Helios XP
用途:退热处理别名:退火炉是否跨境货源:是

Helios XP 快速热处理设备详细介绍

快速热处理设备


RTP refers to a process that heats silicon wafers to high temperatures (up to 1200°C or greater using high intensity lamps to set the electrical properties of the semiconductor devices.


Our thermal products now include a wide range of rapid anneals ranging from soak to spike to millisecond flash.


The Helios XP features an advanced temperature measurement and control system combined with an active compensation algorithm for different wafer emissivities. The Helios XP technology provides high reliability and 20 to 30%cost of ownership advantages, making it the ideal solution for chipmakers seeking a cost-effective RTP solution while meeting the needs for sub-65 nm (including sub-10 nm) device development and production.

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Product Features:

·Excellent Low Temperature Performance

Temperature range down to 200°C

Excellent profile control

Best ambient performance: <1ppm

·Superior Pattern Effect Suppression

Proven DTEC technology suppresses thermal related pattern effects for advanced technology nodes


·Wafer Stress Reduction

Wafer heating from both sides for best stress management

Proactively addressing lithography alignment challenges

·Platform

Dual chamber design

High speed dual arm robot with mechanical throughput > 140 wph

2 x 300 mm load port

6 kw halogen lamp for long life time

Temperature range 200°C – 1300°C

Superior ambient control below 1ppm O2

Process gas N , Ar, O2 , NH3


Highlights:

·Process Flexibility

Wide process range for advanced application in one platform

Ultra-low temperature applications

High temperature activation

Pattern effect solution

·Production proven Solution

More than 250 systems (over 500 process chambers) installed with this platform across a wide range of advanced memory and logic manufacturing


Applications:

·Advanced Logic

·3D NAND Flash

·Next generation DRAM

·CMOS Image Sensor


Process:

·Implant Activation

S/D Anneal

LDD Anneal

High K Anneal

Well Anneal

PLAD Anneal

·Ultra-Shallow Junction Formation

·Silicidation

Cobalt Silicide Formation

Nickel Silicide Formation

Titanium Silicide Formation

·Substrate Engineering




 


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